UNLOCKING
A NEW DIMENSION IN COOLING

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Silicon microfluidic cooling

10X
Higher cooling performance

50X
More energy
efficient cooling

 

THE PROBLEM

From cloud computing to high-performance computing chips tackle global challenges from drug discovery and climate modeling.

 

The performance and efficiency of these chips is held back by the excessive heat they generate which has to travel through many layers before it’s released via an unoptimized air or liquid-cooled cold plate. 

 

This is not only inefficient but also starts to have an enormous environmental impact: The cooling of data centers worldwide consumes more electricity than New York and London combined.

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OUR STORY
 
 

OUR TECHNOLOGY

Silicon microfluidic cooling 

At the core of our technology lies a monolithic, 3-dimensional network of microscopic channels that enable 2,000 W/cm  of heat extraction, extremely low-pressure drop, and reduced coolant consumption. This also enables very low operating temperatures and is a key enabler for future high density and vertically integrated IC designs. 

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Cooling
Right at the core

 

MEDIA COVERAGE

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CONTACT US

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